Symposium A3. Advanced Interconnects and Packaging, Materials, Characterization, and Methodology
Organizers:
| Prof. Jenn-Ming Song | National Chung Hsing University, Taiwan |
| Prof. Jihperng (Jim) Leu | National Chiao Tung University, Taiwan |
| Prof. C. Robert Kao | National Taiwan University, Taiwan |
| Prof. Chih Chen | National Chiao Tung University, Taiwan |
| Prof. Kuan-Neng Chen | National Chiao Tung University, Taiwan |
Scope:
The electronics industry is nearing the limits of traditional CMOS scaling. The requests in capability and functionality of the devices are drastically increasing. Regarding emerging applications of electronic devices, such as healthcare, Industry 4.0, automotive, and so on, revolutionary changes to interconnect and packaging technologies for smarter usage are progressing. The scope of area A3 covers leading edge developments and technical innovations across interconnects and packaging spectrum. Topics ranging from materials and processing, assembly and manufacturing, characterization, and applied reliability are included. The technical sessions under area A3 will provide a perfect opportunity to communicate, interact and exchange technical ideas for anybody in the field of the interconnect and packaging technologies. Papers related to interconnect materials, processes and devices are solicited including (1) Interconnects & Dielectrics, Cu/low-k and those applied in TSV, microbumps, wafer level packaging and system-in-package; (2) Sensor/MEMS/optical integrations; (3) Power/Thermoelectronics packaging; (4) Substrates for different level packages, and interfaces including interactions and intermetallics; (5) Emerging Technologies and Materials; (6) Phase stability and reliability phenomena, e.g. electromigration, thermomigration and their physics.
Topics:
- Interconnects and Dielectrics
- Heterogeneous and Photonic Integration
- Power and Thermoelectronic Packaging
- Substrates and Interfaces
- Emerging Technologies and Materials
- Phase Stability and Reliability
Keynote Speakers & Invited Speakers (tentative):
| 1. Prof. Tadatomo Suga | University of Tokyo, Japan |
| 2. Prof. King-Ning Tu | National Chiao Tung University, Taiwan (UCLA) |
| 3. Dr. Chia-Hong Jan | Intel Corp. Fellow/VP |
| 4. Dr. Jun He | Taiwan Semiconductor Manufacturing Company, Taiwan |
| 5. Prof. Takafumi Fukushima | Tohoku University, Japan |
| 6. Prof. Hiroshi Nishikawa | Osaka University, Japan |
| 7. Prof. Kazuhiro Nogita | The University of Queensland, Australia |
| 8. Prof. Christopher Gourlay | Imperial College, London |
| 9. Prof. Yunhui Mei | Tianjin University, China |