Symposium A4. Advanced Technologies for Memory Devices and Flexible Electronics

Prof. Tzong-Ming LeeIndustry Technology Research Institute, Taiwan
Prof. Wen-Wei WuNational Chiao Tung University, Taiwan
Prof. Fu-Hsiang KoNational Chiao Tung University, Taiwan
Prof. Jr-Hau HeKing Abdullah University of Science & Technology, Saudi Arabia
Dr. Qi LiuInstitute of Microelectronics, Chinese Academy of Sciences, China
Prof. Tuo-Hung HouNational Chiao Tung University, Taiwan
Dr. Jupiter HuIndustry Technology Research Institute, Taiwan
Dr. Hsien-Kuang LinIndustry Technology Research Institute, Taiwan


Data storage and memory devices play an important role in real life applications for processing operations and recording information. New material and device design engineering are required for faster, more reliable, and smaller memory devices. These reasons make the memory field appealing to researchers working on materials with potential for applications.

This symposium will focus on the newest and most significant studies in the memory area covering from scientific fundamentals of the materials challenges to memory devices. Focus areas include, but are not limited to memory device design, scaling, processing, and volatile and nonvolatile modeling. The conventional commodity memory includes semiconductor-based memories, and NAND flash. Additionally, novel memory cells include RRAM, MRAM, FeRAM and PCRAM.

Another important subject we should pay attention to is flexible electronics. Flexible-electronics is rapidly finding many mainstream applications including flexible flat-panel displays, sensors, photovoltaics, and electronic paper. Technologies of flexible electronics include the development of semiconductors, dielectrics, and conducting materials ranging from polymeric semiconductors to nanotube transparent conductors. The devices and processes most suitable for given applications in flexible electronics are challenging and must be integrated with the new emerging material technologies. Novel materials for solution-processable and low-temperature processing are necessary for the preparation of devices on plastic foils. Material techniques for printing and roll-to-roll processing for large-area flexible electronics become very important regarding the device integration on flexible substrates. Mechanical and electronic characteristics for applications towards flexible displays, sensors, actuators, solar energy, radio-frequency identification, and micro-electro-mechanical systems need more efforts to meet the real market requirement.

This session will emphasize not only the advances in materials but also the new device structures that are required for the new materials to substantially improve device performance.

  1. Measurement and performance of memory devices
  2. Structure design and materials choice for novel memory cells
  3. Resistive switching behavior and mechanism
  4. Neuromorphic architectures for logic and data storage
  5. New materials for flexible electronic device
  6. New technologies for printing conductive materials
  7. New flexible substrate for IOT application

Keynote Speakers & Invited Speakers (tentative):
1. Prof. Hyeongtag JeonHanyang University, Korea
2. Prof. Lee Pooi SeeNanyang Technological University, Singapore
3. Prof. Sang-Woo KimSungkyunkwan University, Korea
4. Dr. Shen Guo zhenChinese Academy of Sciences, China
5. Prof. Pey Kin LeongSingapore University of Technology and Design
6. Prof. Gao BinTsinghua University, Beijing, China
7. Prof. Qiangfei XiaUniversity of Massachusetts, USA
8. Dr. Hangbing LvChinese Academy of Sciences, China
9. Prof. Peng ZhouFudan University, China
10. Prof. Liu GangNingbo Institute of Materials Technology and Engineering, CAS, China
11. Prof. Cai YimaoPeking University, China
12. Dr. Pin-Chou LiIndustrial Technology Research Institute, Taiwan
13. Dr. Patrick ChenIndustrial Technology Research Institute, Taiwan
14. Dr. Jeffrey ChiouIndustrial Technology Research Institute, Taiwan
15. Dr. Chun-Wei SuIndustrial Technology Research Institute, Taiwan
16. Dr. Jung-Yu LiaoIndustrial Technology Research Institute, Taiwan
17. Dr. Janglin (John) ChenIndustrial Technology Research Institute , Taiwan